Leaders in semiconductors, packaging, IP suppliers, foundries, and cloud service providers join forces to standardize the chiplet ecosystem.
Highlights of the new standardized chiplet ecosystem:
Advanced Semiconductor Engineering, Inc. (ASE), AMD, Arm, Google Cloud, Intel Corporation, Meta, Microsoft Corporation, Qualcomm Incorporated, Samsung, and Taiwan Semiconductor Manufacturing Company established the new Universal Chiplet Interconnect Express (UCIe) technology to induct a chiplet ecosystem and forthcoming eras of chiplet technologies. The new UCIe 1.0 specification was sanctioned to deliver a comprehensive standardized die-to-die interconnect with physical layer, protocol stack, software model, and compliance testing to encourage end-users to effortlessly swap chiplet components from a multi-vendor ecosystem System-on-Chip (SoC) structure, which also includes customized SoCs. These new open standards will help establish an open chiplet ecosystem and universal interconnect at the package tier. Companies and institutions interested in joining the new ecosystem are highly supported to enter the new grouping of conglomerates freely.
The UCIe organization, illustrating a diverse ecosystem of market elements, will manage customer demands for more customizable package-level integration, merging best-in-class die-to-die interconnects and protocols from an interoperable, multi-vendor ecosystem. Universal Chiplet Interconnect Express (UCIe) is an open specification that defines the interconnect between chiplets within a package, enabling an open chiplet ecosystem and ubiquitous interconnect at the package level. Advanced Semiconductor Engineering, Inc. (ASE), AMD, Arm, Google Cloud, Intel Corporation, Meta, Microsoft Corporation, Qualcomm Incorporated, Samsung, and Taiwan Semiconductor Manufacturing Company are forming an open industry standard organization to promote and further develop the technology and to establish a global ecosystem supporting chiplet design. For more information, visit www.UCIexpress.org. The founding organizations also sanctioned the UCIe specification, an open industry standard created to designate a ubiquitous interconnect at the package level. The UCIe 1.0 specification covers the die-to-die I/O physical layer, die-to-die protocols, and software stack, which leverage the well-established PCI Express® (PCIe®) and Compute Express Link™ (CXL™) industry norms. The specification will be obtainable to UCIe partners and open to download on the organization’s website. The founding organizations portray a broad spectrum of industriousness expertise and contain leading cloud service providers, foundries, system OEMs, silicon IP providers, and chip designers. They are in the strategy of completing incorporation as an open measures group. Upon incorporating the new organization later this year, partnering companies will start operating on the next-gene UCIe technology, including determining the chiplet form factor, management, enhanced security, and other critical protocols. To discover more about membership opportunities, contact admin@UCIexpress.org.
Promoter Statements of Support for Universal Chiplet Interconnect Express (UCIe) gathering
— Mark Papermaster, Executive Vice President and Chief Technology Officer, AMD — Andy Rose, Chief System Architect and Fellow, Arm — Sandra Rivera, Executive Vice President, Intel Corporation and GM, Data Center & AI — Dr. Edward Tiedemann, Senior Vice-President, Engineering, Qualcomm Technologies, Inc. — Cheolmin Park, Vice President of Memory Product Planning Team at Samsung Electronics — Lee-Chung Lu, TSMC Fellow and Vice President of Design and Technology Platform
